146893-1
TE Connectivity / AMP Brand1FHR,64,30A/P,S,C,S08,09,10 ...
DESCRIPTION
146893-1 is a 64-position surface mount receptacle connector designed for board-to-board stacking applications. It features a 1.00 mm centerline pitch with an in-line dual-row contact layout and supports board-to-board stack heights of 8.00 mm, 9.00 mm, and 10.00 mm. The connector utilizes copper alloy contacts with gold (30) plating on the mating area and tin-lead over nickel on the termination area, housed in a black high-temperature thermoplastic body with UL 94V-0 flammability rating. It includes locating posts and a vacuum cover for automated assembly, and is compliant with IEEE 1386 mezzanine connector standards. This connector is ideal for high-density interconnect applications requiring reliable vertical stacking between PCBs.
Product Highlights:
- Receptacle
- 1.00 mm Centerline
- Number of Positions = 64
- Board-to-Board Stack Height = 8.00 mm, 9.00 mm, 10.00 mm
- Gold (30) Contact Mating Area Plating Material
Search Keywords: 1468931
SPECIFICATIONS
IN STOCK: 18,200
Can Ship immediately
MOQ for In Stock Qty: 650
MOQ for out of Stock Qty: 650
Multiple: 650
Factory Lead-Time 12 Weeks
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