DESCRIPTION
SOCKET,MIN-SPR W/H SN SER-5
Search Keywords: 50508716
SPECIFICATIONS
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Products found: 0
Supplier:
TE Connectivity / AMP Brand
Part No:
5050871-6
RoHS:
Yes
HTS:
8538908180
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:
2000
Package Type:
Bag
Sealable:
No
Spring Material:
Beryllium Copper
Sleeve Material:
Copper
Contact Current Rating (Max):
7.5 A
Connector & Contact Terminates To:
Printed Circuit Board
Sleeve Plating Material:
Tin
Contact Base Material:
Beryllium Copper
Termination Method to Printed Circuit Board:
Through Hole - Press-Fit
Termination Method to Wire & Cable:
Solder
Socket Sleeve Style:
Open Bottom
Insertion Method:
Hand/Semi-Automatic
Solder Process Feature:
None
Contact Spring Plating Material:
Tin
Packaging Quantity:
2000
Connector System:
Cable-to-Board
Operating Temperature Range:
-65 – 125 °C, -85 – 257 °F
Wire Size:
18 – 17 AWG, .823 – 1.04 mm²
Packaging Method:
Bag , Loose Piece
Socket Length:
.288 in, 7.32 mm
Contact Spring Plating Thickness:
30 µin, 2.54 µm
Mating Pin Diameter Range:
.042 – .049 in, 1.07 – 1.24 mm
PCB Thickness (Recommended):
.031 – .125 in, .79 – 3.18 mm
Circuit Application:
Power & Signal
PCB Hole Diameter:
.101 in, 2.56 mm
Contact Mating Area Plating Material Thickness:
2.54 µm
Compatible With Wire & Cable Type:
Discrete Wire
IN STOCK: 16,029
Can Ship immediately
MOQ for In Stock Qty: 200
MOQ for out of Stock Qty: 200
Factory Lead-Time 15 Weeks
Price (CAD)
Qty
Unit Price
200
$1.4124
500
$1.3900
1,000
$1.3691
2,500
$1.3496
5,000
$0.7141
7,500
$0.5026
10,000
+
$0.4926
Please Note:
Tariffs may apply for U.S. shipments
English
French
