583859-5 by te connectivity / amp brand
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TE Connectivity / AMP Brand Authorized Distributor

583859-5

TW-LF CRP HSG 18 POS ...

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RoHS Compliant
BAG Packaging
Accessories
Certificate of Compliance

DESCRIPTION

583859-5 is a crimp snap twin leaf connector housing designed for high-density wire-to-board applications. This connector features 18 dual positions with a 0.156 inch (3.96 mm) centerline spacing and includes mounting ears for secure PCB attachment. Key dimensions include A: 2.972 inches (75.49 mm), B: 3.136 inches (79.55 mm), C: 2.848 inches (72.34 mm), D: 3.407 inches (86.54 mm), and E: 3.657 inches (92.89 mm). The housing is designed to accommodate PC boards with thickness of 0.055-0.070 inches (1.40-1.78 mm) and accepts snap-in contacts in various configurations including crimp, post, eyelet, and solder types. This versatile connector is suitable for wire-to-board and board-to-board interconnect applications requiring reliable, high-density connections.

Product Highlights:

  • Housing
  • 18 Dual Positions
  • 3.96 mm Centerline
  • With Mounting Ears

Search Keywords: 5838595

SPECIFICATIONS

Product Attribute
Attribute Value
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Products found: 0
Supplier:
TE Connectivity / AMP Brand
Part No:
583859-5
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8538906000
COO:
US
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Package Type:
BAG
Mounting:
Cable Mount
Body Orientation:
Straight
Gender:
RCP
Number of Contacts:
36
Maximum Voltage Rating:
N/A
Maximum Current Rating:
N/A
Operating Temperature:
-55 to 105 °C

IN STOCK: 1,825

Can Ship immediately

MOQ for In Stock Qty: 4

MOQ for out of Stock Qty: 4

Factory Lead-Time 9 Weeks

Price (USD)

Qty
Unit Price
4
$83.63
25
$83.42
50
$83.20
100
$83.01
200
$43.81
300
$30.13
400 +
$29.52