514-AG11D-ES
TE Connectivity / Buchanan BrandConn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube ...
DESCRIPTION
The 514-AG11D-ES is a 14-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features beryllium copper contacts with gold plating (25 µin) and a four-fingered mating contact style, providing reliable electrical connections for DIP integrated circuits. The socket has a row-to-row spacing of 7.62 mm (0.300 in), a centerline spacing of 2.54 mm (0.100 in), and a height above the PCB of 4.57 mm (0.180 in). It is wave solder capable up to 265°C and operates reliably at temperatures up to 125°C. This socket is commonly used in legacy and industrial applications where DIP package components require secure, repeatable connections on PCBs.
Product Highlights:
- DIP Socket
- Number of Positions = 14
- Row-to-Row Spacing = 7.62 mm
- Thru Hole
- Mount Style = Vertical
Search Keywords: 514AG11DES
SPECIFICATIONS
IN STOCK: 6,464
Can Ship immediately
Minimum Order Quantity: 70
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