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1542005-3 by te connectivity / amp brand

1542005-3

TE Connectivity / AMP Brand

Heat Sink Passive BGA Pin Array Clip Aluminum 11.21 C/W Black Anodized ...

Datasheet
RoHS Compliant
Packaging
Accessories
Discontinued
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DESCRIPTION

Heat Sink Passive BGA Pin Array Clip Aluminum 11.21 C/W Black Anodized

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 21 [.827] mm [in]
  • For Use With BGA Semiconductor Packages
  • Power Air Velocity Thermal Resistance

Search Keywords: 15420053

SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / AMP Brand
Part No:
1542005-3
RoHS:
Yes
HTS:
8414596095
COO:
US
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
50
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
19.05 x 34.95 mm
Thermal Resistance:
11.21 °C/W
Finish:
Black Anodized
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 143

Can Ship immediately

Price (CAD)

Qty
Unit Price
1
$75.555
5
$71.215
10
$70.137
25
$68.628
50
$67.258
100
$66.257
250 +
$65.257
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