Login
EN
English
Français
1-87499-4
08 MODIV HSG COMP SR .100CL ...
DESCRIPTION
The 1-87499-4 is a single-row receptacle housing assembly for the AMPMODU Mod IV interconnection system, featuring an outrigger design with end-to-end stackable capability. It is designed for dual-entry, low-profile applications with 0.100 inch [2.54 mm] by 0.100 inch [2.54 mm] centerline spacing and 0.200 inch [5.08 mm] tine spacing. The housing is constructed from glass-filled thermoplastic material rated 94V-0 and is available in both stamped and unstamped configurations with multiple position options ranging from 1 to 36 positions. Contact plating options include Plating A (duplex gold and matte tin), Plating B (duplex gold and matte tin), and Plating C (matte tin), all with nickel underplating. This housing is ideal for wire-to-board interconnection applications requiring reliable, stackable connections in compact form factors.
Product Highlights:
- Housing
- Not Preloaded
- Number of Positions = 8
- Housing Type = Receptacle
- Number of Rows = Single
Search Keywords: 1874994
SPECIFICATIONS
IN STOCK: 4,392
Ships today, if you order in
MOQ for In Stock Qty: 25
MOQ for out of Stock Qty: 1875
Factory Lead-Time 49 Weeks
3D PDF
Datasheet
Material Declaration - MD_1-87499-4_0617201177
