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573300D00010G by boyd laconia llc

573300D00010G

Boyd Laconia LLC

Heat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized ...

Datasheet
RoHS Compliant
REEL Packaging
Accessories
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DESCRIPTION

The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
573300D00010G
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack:  This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
REEL
Device Cooled:
D2 PAK,TO-263
Attachment Method:
Surface Mount
Dimension:
26.16 x 12.7 x 10.16 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

IN STOCK: 16,086

Ships today, if you order in

MOQ for In Stock Qty: 5

MOQ for out of Stock Qty: 750

Factory Lead-Time 9 Weeks

Price (USD)

Qty
Unit Price
5
$1.524
250
$0.711
500
$0.700
750
$0.670
1,500
$0.659
2,250
$0.628
3,000 +
$0.608
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