3-87456-9 by te connectivity / amp brand
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TE Connectivity / AMP Brand Authorized Distributor

3-87456-9

50 MODIV HSG COMP DR .100CL ...

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RoHS Compliant
BAG Packaging
Accessories
Certificate of Compliance

DESCRIPTION

3-87456-9 is a double-row plain housing designed for the AMPMODU Mod IV wire-to-board interconnection system. This unstamped housing features 50 positions with .100 x .100 inch [2.54 x 2.54 mm] centerline spacing and is manufactured from glass-filled thermoplastic rated 94V-0. The housing accepts receptacle contacts that terminate 32-20 AWG discrete wire and mates with .025 inch square or round posts. With a contact current rating of 3 amperes and dual cantilever contact beam design with anti-overstress feature, this housing is suitable for reliable wire-to-board connections in various electronic applications.

Product Highlights:

  • Housing
  • Not Preloaded
  • Number of Positions = 50
  • Housing Type = Receptacle
  • Number of Rows = Dual

Search Keywords: 3874569

SPECIFICATIONS

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Attribute Value
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Products found: 0
Supplier:
TE Connectivity / AMP Brand
Part No:
3-87456-9
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8538906000
COO:
MX
ECCN:
EAR99
Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
1
Package Type:
BAG
Mounting:
Cable Mount
Body Orientation:
Straight
Gender:
RCP
Number of Contacts:
50
Maximum Voltage Rating:
250 VAC
Maximum Current Rating:
3/Contact A
Operating Temperature:
-65 to 105 °C

IN STOCK: 1,648

Ships today, if you order in

Minimum Order Quantity: 5

Factory Lead-Time 26 Weeks

Price (USD)

Qty
Unit Price
5
$5.22
25
$4.75
100
$4.56
250
$4.46
500
$4.38
1,000
$4.32
2,500
$4.26
5,000 +
$3.53
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