534202B02853G
Boyd Laconia LLCHeat Sink Passive TO-220 Vertical Clip Aluminum 13.4A°C/W Black Anodized ...
DESCRIPTION
534202B02853G is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. The heat sink is constructed from aluminum with black anodize finishing and features a Kool Clip attachment mechanism for secure device mounting. Key dimensional specifications include a width of 25.40 mm, length of 12.70 mm, and height of 29.97 mm, with vertical mounting orientation and specific lead positioning dimensions (X: 11.18 mm, Y: 8.00 mm, Z: 2.39 mm). The product is RoHS compliant and designed for efficient thermal management in compact board-level applications where space constraints and reliable heat dissipation are critical requirements.
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SPECIFICATIONS
IN STOCK: 740
Ships today, if you order in
Minimum Order Quantity: 5
Factory Lead-Time 6 Weeks
Price (USD)
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