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ATS-60001-C1-R0
37.6 x 37.6 x 4.0 mm BGA Heat Sink - High Performance Ultra Low Profile 4.0 mm high adhesive thermal tape blue anodized aluminum ...
DESCRIPTION
The ATS-60001-C1-R0 is a high-performance, ultra-low profile BGA heat sink designed by Advanced Thermal Solutions, Inc. It has a compact size of 37.6 x 37.6 x 4.0 mm, making it ideal for space-constrained applications. Constructed from blue anodized aluminum, this heat sink offers excellent heat dissipation and enhanced durability. It features a 4.0 mm height to efficiently cool high-power BGA devices. Equipped with a high-quality adhesive thermal tape, the ATS-60001-C1-R0 can be easily mounted onto your BGA components, providing an efficient thermal connection for optimal heat transfer. Whether used in consumer electronics, telecommunications, or industrial applications, this BGA heat sink can effectively keep your components cool and ensure their reliable operation.
Mots-clés de recherche: ATS60001C1R0
SPÉCIFICATIONS
EN STOCK: 0
Stock du fabricant: 122 Peut expédier 10/26/26
Quantité minimale de commande pour qté en rupture de stock: 25
DÉLAI DE L'USINE 8 Semaines Peut expédier 12/7/26
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