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ATS-61270D-C1-R0
The ATS-61270D-C1-R0 is a high-performance fanSINK™ heat sink for BGA components featuring a maxiGRIP™ mechanical attachment system. ...
DESCRIPTION
The ATS-61270D-C1-R0 is a 27.00 x 27.00 x 9.50 mm high-performance fanSINK™ heat sink designed for cooling BGA components. It features X-Cut straightFIN fins that allow for omnidirectional air flow, ensuring optimum thermal performance regardless of the PCB layout. The unit utilizes the proven maxiGRIP™ attachment system, a high-reliability mechanical solution that includes a plastic frame clip and a stainless steel spring clip, avoiding the need for PCB through-holes. This attachment method meets Telecordia GR-63-Core, ETSI 300 019, and MIL-STD-810 shock and vibration standards. The heat sink is supplied with pre-assembled Chomerics T412 thermal interface material, making it a robust and convenient solution for demanding electronic applications.
Mots-clés de recherche: ATS61270DC1R0
SPÉCIFICATIONS
EN STOCK: 89
Peut être expédié immédiatement
Stock du fabricant: 50 Peut expédier 8/24/26
Quantité minimale de commande: 5
DÉLAI DE L'USINE 8 Semaines Peut expédier 10/5/26
Prix (USD)
Outils/Modèles 3D
ressources
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