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375424B00034G by boyd laconia llc
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375424B00034G

Boyd Laconia LLC

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices. ...

RoHS Compliant
Bulk Emballage
ACCESSOIRES
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

The 375424B00034G is a square pin fin, board-level heat sink intended for the thermal management of BGA and FPGA components. Constructed from aluminum with a black anodize finish, this heat sink measures 15.20 mm in width, 15.30 mm in length, and 6.35 mm in height. It supports both horizontal and vertical mounting orientations for flexible integration. For secure installation and effective thermal transfer, it comes with pre-applied T410R Chomerics thermal tape. This RoHS compliant heat sink is an effective cooling solution for densely packed electronic assemblies requiring heat dissipation for surface-mount devices.

Search Keywords: 375424B00034G

SPÉCIFICATION

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Products found: 0
fournisseur:
Boyd Laconia LLC
Référence:
375424B00034G
Alias/AKA:
042987
Unité de mesure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710

EN STOCK: 334

Peut être expédié immédiatement

sur commande: 3 360   Peut expédier 6/11/26 

Commande min Quantitè: 25

DÉLAI DE L'USINE 6 Weeks

PRICE (USD)

QTÉ
Prix unitaire
25
$1.155
250
$0.846
500
$0.801
1 000
$0.794
3 360
$0.790
6 720
$0.786
10 080
$0.782
16 800 +
$0.778
Please Note: Tariffs may apply for U.S. shipments

Tools/3D Models