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530614B00000G by boyd laconia llc
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530614B00000G

Boyd Laconia LLC

The 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

Fiche technique
RoHS Compliant
Bulk Emballage
ACCESSOIRES
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DESCRIPTION

The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.

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SPÉCIFICATION

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Products found: 0
fournisseur:
Boyd Laconia LLC
Référence:
530614B00000G
Alias/AKA:
001725
Unité de mesure:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
2000
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
Screw
Dimension:
25.4 x 29.97 x 12.7 mm
Thermal Resistance:
16.7 °C/W
Finish:
Black Anodized

EN STOCK: 3,526

Peut être expédié immédiatement

Commande min Quantitè: 10

DÉLAI DE L'USINE 6 Weeks

PRICE (USD)

QTÉ
Prix unitaire
10
$3.02
50
$2.69
250
$2.47
500
$2.38
2 000
$2.21
4 000 +
$2.20
Emballage standard du fournisseur
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