573300D00010G

Name: 573300D00010G
Brand: Boyd Laconia Llc
SKU: 44922659
Price: 3.28 USD
Availability: BackOrder

Heat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized ...

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Conforme RoHS

Reel Emballage

Certificat de conformité

DESCRIPTION

The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.

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Mots-clés de recherche: 573300D00010G

SPÉCIFICATIONS

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fournisseur:

Boyd Laconia LLC

Référence:

573300D00010G

Alias/également connu sous:

041644

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8473309000

COO:

ECCN:

EAR99

Emballage en bobine: Ces informations sont destinées aux clients qui préfèrent acheter par multiples de la quantité de conditionnement standard du fabricant. Les quantités minimales et les multiples de commande requis sont indiqués avec le prix et la disponibilité.