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S70-220102045R
A circular, surface-mount contact pad designed as a mating area for spring contacts and connectors. ...
DESCRIPTION
The S70-220102045R is a circular surface mount contact pad intended to provide a reliable mating surface for various spring-loaded contacts. This component has a thickness of 0.20 mm and is constructed from a Beryllium Copper base with a gold finish for improved wear resistance and conductivity. It is rated for a current of 0.5A with a maximum contact resistance of 0.15mΩ. Designed for automated assembly, it is supplied in tape and reel packaging and operates over a temperature range of -40°C to +85°C, making it suitable for a wide array of electronic applications.
Mots-clés de recherche: S70220102045R
SPÉCIFICATIONS
EN STOCK: 3
Peut être expédié immédiatement
Achetez les 3 en stock ou la quantité minimale de commande habituelle de 1000
sur commande:
9 000
Peut expédier 1/18/27
Lot de stock uniquement: 3
Quantité minimale de commande: 1000
DÉLAI DE L'USINE 23 Semaines
Prix (CAD)
Outils/Modèles 3D
ressources
Fiche technique
