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MCP2122T-E/SN by microchip technology

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MCP2122T-E/SN

Microchip Technology

Infrared Encoder/Decoder - 115.2KBd - 8-Pin SOIC N - Tape&Reel ...

Fiche technique

RoHS Compliant

REEL Emballage

DESCRIPTION

The MCP2122T-E/SN is an infrared encoder/decoder module designed for easy integration into various applications. It operates at a high baud rate of 115.2KBd and features an 8-pin SOIC N package. This module is supplied in Tape&Reel packaging, ensuring efficient handling and storage. With its reliable infrared encoding and decoding capabilities, the MCP2122T-E/SN is an excellent choice for projects requiring seamless wireless communication.

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Search Keywords: MCP2122TESN

SPÉCIFICATION

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Products found: 0

fournisseur:

Microchip Technology

Référence:

MCP2122T-E/SN

Unité de mesure:

Per Each

RoHS:

Yes

HTS:

8542390090

COO:

TH

ECCN:

EAR99

Reel Pack: This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

3300

Package Type:

REEL

Maximum Operating Supply Voltage:

5.5 V

Maximum Data Rate:

115.2 KBd

Dimension:

4.9 x 3.9 x 1.25(Min) mm

Family:

MCP2122

Minimum Operating Supply Voltage:

1.8 V

Category:

Infrared Encoder/Decoder

Mounting:

Surface Mount

Different packaging options available. See Alternatives

EN STOCK: 5,200

Peut être expédié immédiatement

BONDED Quantity: 0

Manufacturer Stock: 11 Peut expédier 5/18/26

Stock lot only:

Commande min Quantitè: 250

Quantité minimale de commande pour qté en rupture de stock:

Multiple: 1

DÉLAI DE L'USINE 6 Weeks Peut expédier 6/15/26

This product is no longer being manufactured but there may be alternatives. We can help you, NOUS JOINDRE.

PRICE (USD)

QTÉ

Prix unitaire

250

$0.820

500

$0.812

1 000

$0.803

3 300

$0.800

6 600

$0.796

9 900 +

$0.792

Reel Package

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Tools/3D Models

ressources

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Product Changes

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

Product Change Notification

Produits alternatifs

Alternative Packaging
en stock: 0
Commande min Quantitè: 100

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