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000286
Boyd Laconia LLCThermal Interface Material, PAD, 87, 0.410X00.750, W/.156HOLG | Boyd 188761F00000G ...
DESCRIPTION
The 188761F00000G is an In-Sil-8 thermal interface pad designed to provide both thermal conductance and electrical isolation for semiconductor devices. This silicone-based pad features thermally conductive fillers that enable electrical isolation up to 6000 volts AC while maintaining excellent thermal performance. The pad has a thickness of 0.23 mm (0.009 inch), a hardness rating of 85 Shore A, and a mechanical RTI temperature rating of 150°C (302°F), with a UL V-0 flammability rating for safety compliance. It exhibits a tensile strength of 9 MPa and elongation characteristics of 20% at 45° to warp/fill and 5% along width or length, ensuring durability under assembly and harsh environmental conditions. The dark pink colored pad is ideal for applications requiring fast installation without contamination, offering superior performance compared to traditional mica and grease solutions in thermal management for power semiconductors and heat sink assemblies.
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