375324B00035G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized ...
DESCRIPTION
The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.
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SPÉCIFICATION
EN STOCK: 3,316
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 5
Quantité minimale de commande pour qté en rupture de stock: 480
DÉLAI DE L'USINE 9 Weeks
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