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531302B02500G

Name: 531302B02500G
Brand: Boyd Laconia Llc
SKU: 44928210
Price: 30.85 USD
Availability: InStock

Boyd Laconia LLC

Heat Sink Passive TO-202/TO-220 Radial Thru-Hole Aluminum 8°C/W Black Anodized ...

Fiche technique

RoHS Compliant

Bulk Emballage

Garantie du certificat de conformité

DESCRIPTION

531302B02500G is an extruded aluminum board level heat sink from the Extruded 5310 series, designed to cool TO-202 and TO-220 semiconductor devices. This dual radial heat sink features a black anodize finish and requires a mounting kit for device attachment. The heat sink has dimensions of 34.92 mm width, 12.70 mm length, and 63.50 mm height ("H" dimension), with a vertical mounting direction. Additional mounting dimensions include "X" Dim of 12.70 mm, "Y" Dim of 0.79 mm, and "Z" Dim of 2.67 mm. This RoHS compliant heat sink is ideal for board level thermal management applications requiring efficient heat dissipation from power transistors and voltage regulators.

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fournisseur:

Boyd Laconia LLC

Référence:

531302B02500G

Alias/également connu sous:

041678

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8473305100

COO:

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.