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531302B02500G by boyd laconia llc
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531302B02500G

Boyd Laconia LLC

Heat Sink Passive TO-202/TO-220 Radial Thru-Hole Aluminum 8°C/W Black Anodized ...

Fiche technique
RoHS Compliant
Bulk Emballage
ACCESSOIRES
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DESCRIPTION

531302B02500G is an extruded aluminum board level heat sink from the Extruded 5310 series, designed to cool TO-202 and TO-220 semiconductor devices. This dual radial heat sink features a black anodize finish and requires a mounting kit for device attachment. The heat sink has dimensions of 34.92 mm width, 12.70 mm length, and 63.50 mm height ("H" dimension), with a vertical mounting direction. Additional mounting dimensions include "X" Dim of 12.70 mm, "Y" Dim of 0.79 mm, and "Z" Dim of 2.67 mm. This RoHS compliant heat sink is ideal for board level thermal management applications requiring efficient heat dissipation from power transistors and voltage regulators.

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SPÉCIFICATION

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fournisseur:
Boyd Laconia LLC
Référence:
531302B02500G
Alias/AKA:
041678
Unité de mesure:
Per Each
RoHS:
Yes
HTS:
8473305100
COO:
IN
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
750
Package Type:
Bulk
Device Cooled:
TO-202,TO-220
Attachment Method:
Solder Pin
Dimension:
34.92 x 12.7 x 63.5mm
Thermal Resistance:
8 °C/W
Finish:
Black Anodized

EN STOCK: 3,487

Peut être expédié immédiatement

Commande min Quantitè: 5

DÉLAI DE L'USINE 8 Weeks

PRICE (USD)

QTÉ
Prix unitaire
5
$9.45
25
$8.21
50
$7.88
100
$7.56
250
$7.21
750
$6.07
1 500 +
$6.06
Emballage standard du fournisseur
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