532702B02500G
Boyd Laconia LLCThe 532702B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...
DESCRIPTION
The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.
Search Keywords: 532702B02500G
SPÉCIFICATION
EN STOCK: 2,920
Peut être expédié immédiatement
Commande min Quantitè: 5
DÉLAI DE L'USINE 9 Weeks
PRICE (USD)
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