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532702B02500G

Name: 532702B02500G
Brand: Boyd Laconia Llc
SKU: 49765298
Price: 33.25 USD
Availability: InStock

The 532702B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

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RoHS Compliant

Garantie du certificat de conformité

DESCRIPTION

The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.

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fournisseur:

Boyd Laconia LLC

Référence:

532702B02500G

Alias/également connu sous:

041699

Unité de mesure:

Par Each

RoHS:

Yes

COO:

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.