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573100D00010G by boyd laconia llc
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573100D00010G

Boyd Laconia LLC

Heat Sink Passive D PAK/TO-252 SMD Aluminum 25A°C/W Tin ...

Fiche technique
RoHS Compliant
REEL Emballage
ACCESSOIRES
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

The 573100D00010G is a surface mount board level heat sink engineered to dissipate heat from D-Pak and TO-252 packaged semiconductor devices. Constructed from aluminum with a tin-plated finish, this heat sink features dimensions of 8.00 mm width × 10.16 mm length × 22.86 mm height and is mounted horizontally on the printed circuit board. The design includes a recommended copper heat spreader drain pad (14.0 mm × 9.5 mm) and solder mask opening (13.5 mm × 8.9 mm) to optimize thermal coupling and board integration. This heat sink is ideal for applications requiring efficient thermal management of power semiconductors in compact surface-mount assemblies, offering improved heat dissipation performance across varying air velocity conditions.

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SPÉCIFICATION

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Products found: 0
fournisseur:
Boyd Laconia LLC
Référence:
573100D00010G
Alias/AKA:
041639
Unité de mesure:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
Reel Pack: This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.
1
Package Type:
REEL
Device Cooled:
D PAK6707,TO-2526707
Attachment Method:
Surface Mount6706
Dimension:
22.86 x 8 x 10.166714mm
Thermal Resistance:
256717°C/W
Finish:
Tin6710

EN STOCK: 4,525

Peut être expédié immédiatement

Quantité minimale de commande pour qté en stock: 10

Quantité minimale de commande pour qté en rupture de stock: 1125

DÉLAI DE L'USINE 9 Weeks

PRICE (USD)

QTÉ
Prix unitaire
10
$1.133
250
$1.006
500
$0.971
1 125
$0.950
2 250
$0.945
3 375
$0.940
4 500 +
$0.935
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