590102B03600G
Boyd Laconia LLCHeat Sink Passive TO-220 Recessed Thru-Hole Aluminum 10A°C/W Black Anodized ...
DESCRIPTION
The 590102B03600G is a Channel 5901 board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features dimensions of 25.40 mm width, 25.40 mm length, and 42.54 mm height, with a vertical mounting direction for optimal thermal performance. The device requires a mounting kit for attachment and is RoHS compliant, making it suitable for environmentally conscious applications. This heat sink is ideal for power management and thermal regulation in compact board-level cooling applications where space efficiency and reliable heat dissipation are critical.
Search Keywords: 590102B03600G
SPÉCIFICATION
EN STOCK: 746
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 5
Quantité minimale de commande pour qté en rupture de stock: 540
DÉLAI DE L'USINE 6 Weeks
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