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593202B03500G

Name: 593202B03500G
Brand: Boyd Laconia Llc
SKU: 10001380
Price: 62 USD
Availability: InStock

The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

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RoHS Compliant

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Garantie du certificat de conformité

DESCRIPTION

The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.

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fournisseur:

Boyd Laconia LLC

Référence:

593202B03500G

Alias/également connu sous:

042686

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8473309000

COO:

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.