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593202B03500G by boyd laconia llc
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593202B03500G

Boyd Laconia LLC

The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

Fiche technique
RoHS Compliant
Bulk Emballage
ACCESSOIRES
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DESCRIPTION

The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.

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SPÉCIFICATION

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Products found: 0
fournisseur:
Boyd Laconia LLC
Référence:
593202B03500G
Alias/AKA:
042686
Unité de mesure:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
800
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
35.05 x 12.2 x 50.8mm
Thermal Resistance:
10.4 °C/W
Finish:
Black Anodized

EN STOCK: 835

Peut être expédié immédiatement

sur commande: 8 000   Peut expédier 5/28/26 

Quantité minimale de commande pour qté en stock: 5

Quantité minimale de commande pour qté en rupture de stock: 400

DÉLAI DE L'USINE 13 Weeks

PRICE (USD)

QTÉ
Prix unitaire
5
$2.859
100
$0.729
250
$0.715
400
$0.687
800
$0.668
1 200
$0.665
1 600 +
$0.661
Emballage standard du fournisseur
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