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7023B-MTG by boyd laconia llc
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7023B-MTG

Boyd Laconia LLC

Heat Sink Passive TO-220 Folded Back Thru-Hole Aluminum 4.4A°C/W Black Anodized ...

Fiche technique
RoHS Compliant
Bulk Emballage
ACCESSOIRES
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DESCRIPTION

The 7023B-MTG is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features a vertical mounting orientation and requires a mounting kit for device attachment. The heat sink dimensions are 48.26 mm width, 24.13 mm length, and 49.53 mm height, with mounting hole specifications of X: 13.97 mm (0.550 in), Y: 3.18 mm (0.125 in), and Z: 3.10 mm (0.122 in). The device is RoHS compliant and provides thermal management through natural or forced air convection, with thermal performance varying based on air velocity. This heat sink is ideal for applications requiring compact board-level thermal solutions for power semiconductor packages in industrial, automotive, and consumer electronics.

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SPÉCIFICATION

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Products found: 0
fournisseur:
Boyd Laconia LLC
Référence:
7023B-MTG
Alias/AKA:
042270
Unité de mesure:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
300
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Clip/Solder Tab6706
Dimension:
48.26 x 24.13 x 44.456714mm
Thermal Resistance:
4.46717°C/W
Finish:
Black Anodized6710

EN STOCK: 479

Peut être expédié immédiatement

sur commande: 5 100   Peut expédier 6/4/26 

Commande min Quantitè: 5

DÉLAI DE L'USINE 14 Weeks

PRICE (USD)

QTÉ
Prix unitaire
5
$8.79
25
$8.40
50
$8.25
100
$8.11
300
$7.99
600
$7.97
1 200
$7.95
2 700 +
$7.93
Emballage standard du fournisseur
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