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7023B-MTG

Name: 7023B-MTG
Brand: Boyd Laconia Llc
SKU: 44923036
Price: 43.95 USD
Availability: InStock

Boyd Laconia LLC

Heat Sink Passive TO-220 Folded Back Thru-Hole Aluminum 4.4A°C/W Black Anodized ...

Fiche technique

RoHS Compliant

Bulk Emballage

Garantie du certificat de conformité

DESCRIPTION

The 7023B-MTG is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features a vertical mounting orientation and requires a mounting kit for device attachment. The heat sink dimensions are 48.26 mm width, 24.13 mm length, and 49.53 mm height, with mounting hole specifications of X: 13.97 mm (0.550 in), Y: 3.18 mm (0.125 in), and Z: 3.10 mm (0.122 in). The device is RoHS compliant and provides thermal management through natural or forced air convection, with thermal performance varying based on air velocity. This heat sink is ideal for applications requiring compact board-level thermal solutions for power semiconductor packages in industrial, automotive, and consumer electronics.

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fournisseur:

Boyd Laconia LLC

Référence:

7023B-MTG

Alias/également connu sous:

042270

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8536694040

COO:

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.