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DESCRIPTION
The C&K COMPONENTS SDA01H0SB is a low-profile DIP (Dual In-line Package) component designed for efficient circuit connectivity. With its sleek and compact design, this component allows for space-saving integration in electronic assemblies without compromising on performance. It features a reliable construction that ensures long-lasting durability. The SDA01H0SB is perfect for applications where a low-profile and space-saving solution is required, making it an ideal choice for various electronic devices and systems.
Mots-clés de recherche: SDA01H0SB
SPÉCIFICATIONS
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DÉLAI DE L'USINE 19 Semaines
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