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24LC1025T-I/SM

en stock: 2 900

Commande min: 100

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24LC1025-I/SM by microchip technology

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24LC1025-I/SM

EEPROM - Serial I²C - 1 Mbit (128K x 8) - 2.5V/3.3V/5V - 400 kHz - 8 Pin SOIC-W - Tube ...

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Conforme RoHS

TUBE Emballage

DESCRIPTION

The 24LC1025-I/SM is a 1024kb (128k x 8) Serial Electrically Erasable PROM (EEPROM) capable of operation across a broad voltage range (2.5 to 5.5V). It has been developed for advanced, low-power applications such as personal communications or data acquisition. This device has both byte write and page write capability of up to 128-byte of data. This device is capable of both random and sequential reads. Reads may be sequential within address boundaries 0000h to FFFFh and 10000h to 1FFFFh. Functional address lines allow up to four devices on the same data bus. This allows for up to 4Mb total system EEPROM memory.

Points forts du produit:

Applications potentielles:

Mots-clés de recherche: 24LC1025ISM

SPÉCIFICATIONS

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Produits trouvés : 0

fournisseur:

Microchip Technology

Référence:

24LC1025-I/SM

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

EAR99

Conditionnement standard du fournisseur: Ces informations sont fournies aux clients qui préfèrent acheter par multiples de la quantité d

Ces informations sont fournies aux clients qui préfèrent acheter par multiples de la quantité d

90

Type de boîtier:

TUBE

Rétention des données:

200(Min) Year

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EN STOCK: 600

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Quantité BONDED: 0

Stock du fabricant: 0

sur commande: 920 Peut expédier 8/31/26

Lot de stock uniquement:

Quantité minimale de commande: 5

Quantité minimale de commande pour qté en rupture de stock:

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DÉLAI DE L'USINE 13 Semaines

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Prix (USD)

QTÉ

Prix unitaire

5

$4.65

90

$4.11

180

$4.07

270

$4.06

540

$4.05

1 080

$4.04

2 520

$4.03

5 040 +

$4.02

Emballage standard du fournisseur

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Outils/Modèles 3D

ressources

Fiche technique

Modifications du produit

PCN - 31-Oct-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 22-Oct-2013 - Microchip is announcing the qualification of the listed 24xx1025, 24xx1026, and 24xx515 device famil

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 12-Aug-2013 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024K I2C CMOS SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 28-Apr-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

PCN - 19-Jan-2011 - Microchip has released a new DeviceDoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C? CMOS Ser

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 06-Mar-2006 -

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 18-Apr-2012 - Microchip has released a new devicedoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C CMOS seri

PCN - 28-Apr-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 08-Nov-2021 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024-KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 11-Dec-2009 - Microchip is moving 160K Double Layer Metal (DLM), (0.4 micron)fabrication process to the 160K Tripl

PCN - 11-Nov-2004 -

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C? CMOS Ser

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 19-Feb-2010 - RELEASED A NEW DEVICE DOC

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 01-Nov-2011 - QUALIFICATION OF CERTAIN CATALOG PART NUMBERS IN THE 8L SOIJ PACKAGE WITH 8006NS DIE ATTACH AT MTAI

PCN - 01-Nov-2011 - Microchip is announcing the qualification of certain catalog part numbers in the 8L SOIJ package wit

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat

PCN - 19-Jan-2011 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE SERIAL EEPROM DATA SHEET OF DEVICES.

PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD

PCN - 19-Feb-2010 - Microchip has released a new DeviceDoc for the 24AA1025/24LC1025/24FC1025 1024K I2C CMOS Serial EEPR

PCN - 12-Aug-2013 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024K I2C CMOS SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 11-Dec-2009 - CONVERSION OF 24LC1025, 24FC1025 AND 24AA1025 PRODUCT FAMILIES TO 160K TRIPLE LAYER METAL (TLM)

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 03-Aug-2011 - Microchip is announcing the qualification of certain catalog part numbers in the 8L SOIJ package wit

PCN - 29-Oct-2007 - Change in BOM as well as TOP DIE and/or spacer DIE thickness.

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 03-Aug-2011 - QUALIFICATION OF CERTAIN CATALOG PART NUMBERS IN THE 8L SOIJ PACKAGE WITH 8006NS DIE ATTACH AT MTAI

PCN - 12-Aug-2013 - Microchip has released a new devicedoc for the 24AA1025/24LC1025/24FC1025 1024K I2C CMOS serial EEPR

PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 19-Oct-2007 - New assembly site for 24AA /LC/FC Products.

PCN - 22-Oct-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND WITHOUT LEAD LOCK FEATURE

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 31-Oct-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

PCN - 18-OCT-2023 - Added a new fabrication site

PCN - 07-NOV-2023 - Added a new fabrication site

PCN - 11-Nov-2004 - Product Change Notice

PCN - 06-Mar-2006 - Product Change Notice

Product Change Notification

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