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DSPIC33FJ128GP706-I/PT by microchip technology

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DSPIC33FJ128GP706-I/PT

MCU - 16-bit dsPIC - 128KB Flash - 16KB RAM - -40°C to +85°C - 3.3V - 64-Pin TQFP - Tray ...

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Conforme RoHS

TRAY Emballage

Ce produit peut nécessiter une documentation supplémentaire. L'expédition peut être retardée de 1-2 jours.

DESCRIPTION

The MICROCHIP TECH. part DSPIC33FJ128GP706-I/PT is a powerful 16-bit microcontroller unit (MCU) that is designed for applications requiring high-performance digital signal processing capabilities. It features 128KB of Flash memory and 16KB of RAM, providing ample storage for program code and data. With a wide operating temperature range of -40Â°C to +85Â°C, this MCU is suitable for use in harsh environments. It operates at a voltage of 3.3V and is housed in a 64-pin TQFP package. The tray packaging ensures easy handling and storage.

Points forts du produit:

Applications potentielles:

Mots-clés de recherche: DSPIC33FJ128GP706IPT

SPÉCIFICATIONS

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fournisseur:

Microchip Technology

Référence:

DSPIC33FJ128GP706-I/PT

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8542310020

COO:

TH

ECCN:

3A991.a.2

Conditionnement standard du fournisseur: Ces informations sont fournies aux clients qui préfèrent acheter par multiples de la quantité d

Ces informations sont fournies aux clients qui préfèrent acheter par multiples de la quantité d

160

Type de boîtier:

TRAY

Température de fonctionnement:

-40 to 85 °C

Taille de la mémoire de programme:

128 KB

Résolution ADC:

10/12 bit

Nombre d'E/S programmables:

53

Type de mémoire programme:

Flash

Taille de la RAM:

16 KB

EN STOCK: 160

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Quantité BONDED: 0

Stock du fabricant: 0

Lot de stock uniquement:

Quantité minimale de commande pour qté en stock: 5

Quantité minimale de commande pour qté en rupture de stock: 40

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DÉLAI DE L'USINE 29 Semaines

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Prix (USD)

QTÉ

Prix unitaire

5

$12.80

10

$12.77

25

$12.74

40

$12.71

80

$9.54

120

$8.90

160 +

$8.72

Emballage standard du fournisseur

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Outils/Modèles 3D

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Modifications du produit

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 27-Mar-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE

PCN - 07-Jan-2013 - ERRATA - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 03-Aug-2010 - Mcrochip is announcing the qualification of the listed YGAGx products at an additional wafer fabrica

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 22-Jul-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 09-Jun-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 25-Jan-2012 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 25-Aug-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 11-Nov-2004 -

PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)

PCN - 29-Jan-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 03-Jun-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 04-Mar-2011 - QUALIFICATION OF YGAB, YGAG, YGAE, YGAK, YGAP, AND UDAA MASKS WITHOUT POLYIMIDE PROCESS.

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 12-May-2008 - Modifications have been made to the 16-bit MPLAB C libraries for the self-programming routines_write

PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 25-Jan-2012 - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA & DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

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