Free Shipping

DSPIC33FJ128GP706-I/PT by microchip technology

Image non contractuelle - consultez les spécifications du fabricant

DSPIC33FJ128GP706-I/PT

Microchip Technology

MCU - 16-bit dsPIC - 128KB Flash - 16KB RAM - -40°C to +85°C - 3.3V - 64-Pin TQFP - Tray ...

Fiche technique

RoHS Compliant

TRAY Emballage

This product may require extra documentation. Shipping may be delayed 1-2 days.

DESCRIPTION

The MICROCHIP TECH. part DSPIC33FJ128GP706-I/PT is a powerful 16-bit microcontroller unit (MCU) that is designed for applications requiring high-performance digital signal processing capabilities. It features 128KB of Flash memory and 16KB of RAM, providing ample storage for program code and data. With a wide operating temperature range of -40Â°C to +85Â°C, this MCU is suitable for use in harsh environments. It operates at a voltage of 3.3V and is housed in a 64-pin TQFP package. The tray packaging ensures easy handling and storage.

Points forts du produit:

Potential Applications:

Search Keywords: DSPIC33FJ128GP706IPT

SPÉCIFICATION

Attribut du produit

Valeur de l'attribut

Sélectionner un attribut

Produits trouvés : 0

fournisseur:

Microchip Technology

Référence:

DSPIC33FJ128GP706-I/PT

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8542310020

COO:

TH

ECCN:

3A991.a.2

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

160

Package Type:

TRAY

Température de fonctionnement:

-40 to 85 °C

Taille de la mémoire de programme:

128 KB

Résolution ADC:

10/12 bit

Nombre d'E/S programmables:

53

Type de mémoire programme:

Flash

Taille de la RAM:

16 KB

EN STOCK: 160

Peut être expédié immédiatement

BONDED Quantity: 0

Manufacturer Stock: 0

Stock lot only:

Quantité minimale de commande pour qté en stock: 5

Quantité minimale de commande pour qté en rupture de stock: 40

Multiple: 1

DÉLAI DE L'USINE 27 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, NOUS JOINDRE.

Prix (USD)

QTÉ

Prix unitaire

5

$12.80

10

$12.77

25

$12.74

40

$12.71

80

$9.54

120

$8.90

160 +

$8.72

Emballage standard du fournisseur

Log in for special pricing

Outils/Modèles 3D

ressources

Fiche technique

Product Changes

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 27-Mar-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE

PCN - 07-Jan-2013 - ERRATA - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 03-Aug-2010 - Mcrochip is announcing the qualification of the listed YGAGx products at an additional wafer fabrica

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 22-Jul-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 09-Jun-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 25-Jan-2012 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 25-Aug-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 11-Nov-2004 -

PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)

PCN - 29-Jan-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 03-Jun-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 04-Mar-2011 - QUALIFICATION OF YGAB, YGAG, YGAE, YGAK, YGAP, AND UDAA MASKS WITHOUT POLYIMIDE PROCESS.

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 12-May-2008 - Modifications have been made to the 16-bit MPLAB C libraries for the self-programming routines_write

PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 25-Jan-2012 - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA & DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

Les clients ont également acheté

MINI CT SGL DIP H 6P NAT

Switch DIP ON OFF SPST 6 Recessed Slide 0.025A 24VDC Gull Wing 1000Cycles 1.27mm SMD Tube

Cap Film 0.001uF 50V PPS 2% (2 X 1.25 X 0.9mm) Stacked 125°C T/R

Female Screwlock Kit.

Heat Sink Passive Pin Array SMD Aluminum 6063-T5 31K/W Black Anodized