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Integrated Circuits - ICs
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I/O Expanders
MCP23S08-E/SS

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Alternative Packaging

MCP23S08T-E/SS

en stock: 0

Commande min: 250

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MCP23S08-E/SS by microchip technology

Image is representational - see mfr. specs

MCP23S08-E/SS

Microchip Technology

I/O Expander - 8bit - 10 MHz - SPI - 1.8 to 5.5 V - SSOP - 20-Pin. ...

Fiche technique

RoHS Compliant

TUBE Emballage

ACCESSOIRES

Certificate of Compliance Guarantee

DESCRIPTION

The MCP23S08-E/SS is a 8-bit general purpose, parallel I/O Expansion for SPI applications. The MCP23S08 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding input or output register. The polarity of the input port register can be inverted with the polarity inversion register. All registers can be read by the system master.

Product Highlights:

Potential Applications:

Search Keywords: MCP23S08ESS

SPÉCIFICATION

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fournisseur:

Microchip Technology

Référence:

MCP23S08-E/SS

Unité de mesure:

Per Each

RoHS:

Yes

HTS:

8542390090

COO:

TH

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

67

Package Type:

TUBE

Interrupt Output:

Yes

Interface Speed:

10000 kHz

Manual Reset:

Yes

Family:

MCP23S08

Interface Type:

SPI

I2C Bus Interface Mode:

N/R

Maximum Operating Supply Voltage:

5.5 V

Dimension:

7.2 x 5.3 x 1.75 mm

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product is not in stock and cannot be back-ordered

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

EN STOCK: 1,593

Peut être expédié immédiatement

BONDED Quantity: 0

Manufacturer Stock: 0

Stock lot only: 52

Commande min Quantitè: 67

Quantité minimale de commande pour qté en rupture de stock:

Multiple: 67

DÉLAI DE L'USINE 16 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, NOUS JOINDRE.

Your order may include a combination of full reels and cut tape depending on available stock.

Need guaranteed full reels? Contact Sales

PRICE (USD)

A tariff of {0} may be applied if shipping to the United States.

QTÉ

Prix unitaire

67

$1.177

268

$1.129

536

$1.113

1 005

$1.057

2 546

$1.018

5 025

$1.015

7 504

$1.005

10 050 +

$1.002

Emballage standard du fournisseur

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

Reel Packaging

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

Log in for special pricing Click for Quote Price Match Request

Schedule Order

You may schedule release quantities and ship dates in the shopping cart.

Tools/3D Models

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Fiche technique

Product Changes

PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co

PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at

PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS

PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE AT ANAP

PCN - 14-Jul-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300

PCN - 24-Mar-2017 - UPDATION- QUALIFICATION OF SILVER (AG)-ON-LEADS PLATED LEAD FRAME

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Mar-2007 -

PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 08-Jun-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE

PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 12-Dec-2018 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 11-Nov-2004 -

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS

PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

PCN - 22-Mar-2017 - QUALIFICATION OF SILVER (AG)-ON-LEADS PLATED LEAD FRAME

PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 14-Feb-2019 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K

PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS

PCN - 24-Mar-2017 - UPDATION QUALIFICATION OF SILVER (AG)-ON-LEADS PLATED LEAD FRAME

PCN - 11-Nov-2004 - Product Change Notice

PCN - 08-Mar-2007 - Product Change Notice

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