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MCP2515T-I/SO

en stock: 3 788

Commande min: 250

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MCP2515-I/SO by microchip technology

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MCP2515-I/SO

Microchip Technology

CanBus Bus - Controller - 1Mbps - Sleep/Standby - 3.3V/5V - 18-Pin. ...

Fiche technique

RoHS Compliant

TUBE Emballage

DESCRIPTION

Microchip Technology's MCP2515-I/SO is a stand alone Controller Area Network (CAN) controller. It is capable of transmitting and receiving both standard and extended data and remote frames. The MCP2515-I/SO has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCU's overhead. The MCP2515-I/SO interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI).

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Potential Applications:

Search Keywords: MCP2515ISO

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fournisseur:

Microchip Technology

Référence:

MCP2515-I/SO

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8542390090

COO:

TH

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

42

Package Type:

TUBE

Famille:

MCP2515

Catégorie:

Controller

Dimension:

11.55 x 7.5 x 2.05(Min) mm

Different packaging options available. See Alternatives

EN STOCK: 1,512

Peut être expédié immédiatement

BONDED Quantity: 0

Manufacturer Stock: 0

sur commande: 1 050 Peut expédier 9/21/26

Stock lot only:

Commande min Quantitè: 42

Quantité minimale de commande pour qté en rupture de stock:

Multiple: 42

DÉLAI DE L'USINE 12 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, NOUS JOINDRE.

Prix (USD)

QTÉ

Prix unitaire

42

$1.93

126

$1.87

252

$1.80

504

$1.78

1 008

$1.69

2 520

$1.68

5 040

$1.67

7 518 +

$1.66

Emballage standard du fournisseur

Log in for special pricing

Outils/Modèles 3D

ressources

Fiche technique

Part Status Change - 20-Aug-2020 - Status changed from Active to NRFND

Product Changes

PCN - 13-Oct-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE

PCN - 17-Nov-2010 - Microchip has released a new DeviceDoc for the listed MCP2515 Data Sheet of devices.

PCN - 10-Jan-2018 - MCP2515 SILICON ERRATA DOCUMENT REVISION

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB

PCN - 18-Jan-2011 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM

PCN - 11-Nov-2004 -

PCN - 09-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 10-Jan-2018 - MCP2515 SILICON ERRATA DOCUMENT REVISION

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 28-Aug-2012 - MCP2515 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at

PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 18-Jan-2011 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 22-Apr-2021 - DOCUMENT CHANGE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 09-Dec-2016 - DATA SHEET - MCP2515 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 17-Nov-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE MCP2515 DATA SHEET OF DEVICES.

PCN - 01-Apr-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM

PCN - 09-Dec-2016 - DATA SHEET - MCP2515 DATA SHEET DOCUMENT REVISION

PCN - 29-Jan-2019 - DATA SHEET - MCP2515 STAND-ALONE CAN CONTROLLER WITH SPI INTERFACE DATA SHEET

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 06-Nov-2003 -

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 07-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 07-Oct-2005 -

PCN - 01-Apr-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 18-Feb-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 09-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 12-Oct-2020 - QUALIFICATION OF QMI-519 DIE ATTACH MATERIAL FOR SELECTED PRODUCTS

PCN - 28-Aug-2012 - Microchip has released a new devicedoc for the MCP2515 data sheet of devices in order to improve pro

PCN - 16-Aug-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 28-Jun-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM

PCN - 07-Oct-2005 - 18L SOIC 300'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

PCN - 13-Feb-2021 - QUALIFICATION OF QMI-519 DIE ATTACH MATERIAL FOR SELECTED PRODUCTS

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 13-Oct-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE

PCN - 03-Nov-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 07-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

PCN - 29-Jun-2016 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 18L SOIC PACKAGE (PDCU) BOND WIRE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 07-Oct-2005 - Product Change Notice

PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 11-Nov-2004 - Product Change Notice

PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 31-May-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 28-Feb-2011 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 06-Nov-2003 - Product Change Notice

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