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Integrated Circuits - ICs
Linear
Amplifiers - Op Amps, Buffer, Instrumentation
MCP607T-I/SN

MCP607T-I/SN by microchip technology

Image is representational - see mfr. specs

MCP607T-I/SN

Microchip Technology

2.5V to 6.0V - Micropower CMOS - Dual Op Amp - Industrial Temperature - 8LD SOIC Package ...

Fiche technique

RoHS Compliant

REEL Emballage

ACCESSOIRES

Certificate of Compliance Guarantee

DESCRIPTION

The MCP607T-I/SN is a dual operational amplifier unity-gain stable with low offset voltage (250 µV, maximum). Performance characteristics include rail-to-rail output swing capability and low input bias current (80 pA at +85°C, maximum). It works in industrial temp. range -40°C-85°C. Package type is a plastic SOIC (3.90 mm body), 8-lead.

Product Highlights:

Potential Applications:

Search Keywords: MCP607TISN

SPÉCIFICATION

Product Attribute

Attribute Value

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fournisseur:

Microchip Technology

Référence:

MCP607T-I/SN

Unité de mesure:

Per Each

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

Reel Pack: This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

3300

Package Type:

REEL

Manufacturer Type:

Micropower Amplifier

Maximum Input Offset Current:

0.000001(Typ)@5.5V uA

Family:

MCP607

Maximum Dual Supply Voltage:

N/R

Maximum Operating Supply Voltage:

6 V

Dimension:

4.9 x 3.9 x 1.25(Min) mm

Maximum Input Bias Current:

N/A

Maximum Input Offset Voltage:

0.25@5.5V mV

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product is not in stock and cannot be back-ordered

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

EN STOCK: 3,550

Peut être expédié immédiatement

BONDED Quantity: 0

Manufacturer Stock: 10 Peut expédier 5/18/26

Stock lot only:

Quantité minimale de commande pour qté en stock: 250

Quantité minimale de commande pour qté en rupture de stock: 825

Multiple: 1

DÉLAI DE L'USINE 5 Weeks Peut expédier 6/8/26

This product is no longer being manufactured but there may be alternatives. We can help you, NOUS JOINDRE.

Your order may include a combination of full reels and cut tape depending on available stock.

Need guaranteed full reels? Contact Sales

PRICE (USD)

QTÉ

Prix unitaire

250

$1.965

500

$1.960

825

$1.955

1 650

$1.203

2 475

$0.953

3 300 +

$0.933

Reel Package

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

Reel Packaging

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

Log in for special pricing Click for Quote Price Match Request

Schedule Order

You may schedule release quantities and ship dates in the shopping cart.

Tools/3D Models

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Product Changes

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 11-Nov-2004 - Product Change Notice

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 26-May-2005 - Product Change Notice

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 24-Sep-2009 - Microchip Has Released A New Devicedoc For The 2.5V To 6.0V Micropower Cmos Op Amp Of Devices

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 22-Jan-2004 - Product Change Notice

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 08-Mar-2007 - Product Change Notice

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 24-Sep-2009 - Microchip Has Released A New Device Document For The 2.5V To 6.0V Micropower Cmos Op Amp Of Devices.

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

Product Change Notification

Produits alternatifs

Alternative Packaging
en stock: 0
Commande min Quantitè: 100

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