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PIC16F687-I/P by microchip technology

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PIC16F687-I/P

Microchip Technology

MCU 8-bit PIC16 PIC RISC 3.5KB Flash 5V Automotive 20-Pin PDIP Tube ...

Fiche technique

RoHS Compliant

TUBE Emballage

DESCRIPTION

The Microchip Tech. part PIC16F687-I/P is a powerful 8-bit microcontroller (MCU) designed for a wide range of automotive applications. This PIC RISC MCU features 3.5KB of Flash memory and operates at 5V. Its 20-pin PDIP package makes it easy to integrate into your designs, and it comes packaged in a protective tube for convenience and durability. Trust the PIC16F687-I/P for reliable performance in your automotive projects.

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Search Keywords: PIC16F687IP

SPÉCIFICATION

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Products found: 0

fournisseur:

Microchip Technology

Référence:

PIC16F687-I/P

Unité de mesure:

Per Each

RoHS:

Yes

HTS:

8542310015

COO:

TH

ECCN:

EAR99

Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

22

Package Type:

TUBE

RAM Size:

128 B

Program Memory Size:

3.5 KB

ADC Resolution:

10 bit

Program Memory Type:

Flash

Operating Temperature:

-40 to 85 °C

Number of Programmable I/Os:

17

EN STOCK: 22

Peut être expédié immédiatement

BONDED Quantity: 0

Manufacturer Stock: 12 Peut expédier 5/18/26

Stock lot only:

Commande min Quantitè: 22

Quantité minimale de commande pour qté en rupture de stock:

Multiple: 22

DÉLAI DE L'USINE 5 Weeks Peut expédier 6/8/26

This product is no longer being manufactured but there may be alternatives. We can help you, NOUS JOINDRE.

PRICE (USD)

QTÉ

Prix unitaire

22

$2.418

66

$2.306

264

$2.261

506

$2.250

1 012

$2.238

2 508

$2.227

5 016

$2.217

7 502 +

$2.205

Emballage standard du fournisseur

Log in for special pricing

Tools/3D Models

ressources

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Product Changes

PCN - 21-Dec-2005 - QUALIFICATION OF 20L SOIC (.300'')PACKAGE AT NSEB

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 22-May-2010 - ERRATA-PIC16F631/677/685/687/689/690 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 01-Apr-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT ALPH(MMT) ASSEMBLY SITE

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 01-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MMT ASSEMBLY SITE

PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 19-Apr-2010 - Microchip is announcing the qualification of 16L & 20L SOIC (.300) at GTK (GRTK) assembly site in or

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 01-May-2006 - QUALIFICATION OF NEW ASSEMBLY SITE

PCN - 30-Jul-2010 - QUALIFICATION OF 16L & 20L SOIC (.300) AT GTK (GRTK) ASSEMBLY SITE.

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 21-Sep-2011 - Microchip is releasing the v9.83 HI-Tech C for the listed PIC10/12/16 MCUs in order to provide new s

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 30-Nov-2007 - CHANGE IN BOM

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 01-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MMT ASSEMBLY SITE

PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 16-Jan-2006 - QUALIFICATION OF 20L SOIC AT MMT, THAILAND

PCN - 05-Sep-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES

PCN - 01-Apr-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT ALPH(MMT) ASSEMBLY SITE

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 06-Mar-2006 -

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

PCN - 11-Nov-2004 -

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 01-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

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