HSS-B20-0503H
Stamped Heat Sink - TO-220 - Aluminum - PCB - 5.03 mm Horizontal Solder Pin ...
DESCRIPTION
HSS-B20-0503H is an aluminum heat sink designed for thermal management of TO-220 package components. It features a black anodized finish on AL1050 aluminum material with a thickness of 1.2 mm and weighs 6.0 g. The heat sink includes a round hole for component attachment and brass solder pins with tin plating for secure PCB mounting. This heat sink is suitable for applications requiring efficient heat dissipation from power semiconductors and other TO-220 packaged devices, providing reliable thermal performance in both natural convection and forced airflow conditions.
Mots-clés de recherche: HSSB200503H
SPÉCIFICATIONS
EN STOCK: 2 922
Expédition today, Saisissez la valeur du paramètre.
Quantité minimale de commande: 25
DÉLAI DE L'USINE 14 Semaines
English
Français
