DESCRIPTION
103635-2 is a single-row right-angle through-hole (THT) header without hold down, part of the TE Connectivity AMPMODU MTE interconnect system designed for wire-to-board and wire-to-wire applications. This header features 15 µ" gold plating and supports 2-25 positions per row with a 100 mil centerline pitch. The connector operates over a temperature range of -65°C to +105°C and supports a maximum current rating of 3 amps per single contact in free air. Common applications include medical instruments, automotive controls, computers, commercial printers, appliances, and telecommunications equipment where reliable board-level connections are required.
Product Highlights:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 3
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
Search Keywords: 1036352
SPÉCIFICATION
EN STOCK: 33,548
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 104
Quantité minimale de commande pour qté en rupture de stock: 104
Multiple: 52
DÉLAI DE L'USINE 25 Weeks
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