Connexion
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DESCRIPTION
The 103639-8 is a vertical through-hole IDC (Insulation Displacement Contact) header connector from the TE Connectivity AMPMODU MTE interconnect system, featuring matte tin plating for standard applications. This connector supports 2–25 position configurations with a 100 mil centerline spacing and accommodates wire gauges in the #22–#30 AWG range for IDC configurations. The product is designed for wire-to-board applications and operates reliably across a temperature range of -65°C to +105°C, with a current rating of 3 amps per contact in free air and 267 V operating voltage. The connector implements latching and polarization features through coupling shrouds and guide ribs, making it suitable for use in computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where reliable interconnection is essential.
Mots-clés de recherche: 1036398
SPÉCIFICATIONS
EN STOCK: 550
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Quantité minimale de commande pour qté en stock: 42
Quantité minimale de commande pour qté en rupture de stock: 42
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DÉLAI DE L'USINE 15 Semaines
3D PDF
Product Drawing - HDR ASY,VERT,SNGL ROW 2.54.100 C/L 0.64.025 SQ PST, WTH PLZN<CHNG,AMPMODU MTE
Fiche technique
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
