Connexion
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DESCRIPTION
103669-9 is a swaged tall vertical through-hole (THT) header with matte tin plating, part of the AMPMODU MTE interconnect system from TE Connectivity. This header is designed for wire-to-board connectivity applications and features polarization and latching capabilities to ensure secure mating. The product supports 2 to 25 positions per row with 100 mil centerline spacing, accommodates wire gauges from #22 to #30 AWG for IDC configurations, and operates reliably across a temperature range of -65°C to +105°C. With a current rating of 3 amps per single contact in free air and an operating voltage of 267 V, this header is well-suited for industrial applications including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where cost-effective, reliable interconnection is required.
Points forts du produit:
- Header
- Number of Positions = 10
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
Mots-clés de recherche: 1036699
SPÉCIFICATIONS
EN STOCK: 1 114
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 152
Quantité minimale de commande pour qté en rupture de stock: 152
Ce modèle de message est utilisé pour informer un affilié qu'une certaine commande a été payée. La commande obtient le statut Payée lorsque le montant a été débité.: 19
DÉLAI DE L'USINE 27 Semaines
3D PDF
Product Drawing - HDR ASSY, VERT, SR 2.54 .100 C/L 0.64 .025 SQ POST WITH PLZN, AMPMODU MTE
Fiche technique
Product Specification - Connector, AMPMODU, MTE
Instruction Sheet - AMPMODU MTE CONNECTORS
