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DESCRIPTION
The 103670-4 is an MTE Crimp Pin Housing designed for the AMPMODU MTE interconnect system, which serves wire-to-board and wire-to-wire applications across industrial equipment including computers, medical instruments, automotive controls, and telecommunications systems. This housing accommodates 5-position crimp snap-in pin contacts and supports the flexible AWG range of #20–#32 for crimp configurations. The product is available with three plating options (15 µ" Au, 30 µ" Au, and Matte Tin) and operates reliably over a temperature range of -65°C to +105°C. The housing features latching and polarization capabilities, with swage options on posts providing retention in printed circuit boards. This component is ideal for applications requiring cost-effective, medium-volume assembly with flexibility in wire gauge selection.
Points forts du produit:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 5
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
Mots-clés de recherche: 1036704
SPÉCIFICATIONS
EN STOCK: 4 378
Peut être expédié immédiatement
Quantité minimale de commande: 210
Ce modèle de message est utilisé pour informer un affilié qu'une certaine commande a été payée. La commande obtient le statut Payée lorsque le montant a été débité.: 35
DÉLAI DE L'USINE 17 Semaines
3D PDF
Product Drawing - HDR ASSY, VERT, SINGLE ROW 2.54[.100] CL, 0.64[.025] SQ POST, WITH PLZN
Fiche technique
Product Specification - Connector, AMPMODU, MTE
Instruction Sheet - AMPMODU MTE CONNECTORS
