DESCRIPTION
103735-2 is a single-row vertical through-hole (THT) header connector from the AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced durability and conductivity. This connector is designed for wire-to-board applications and supports 2–25 positions per row with a 100 mil centerline spacing. It accommodates wire gauges from #22–#30 AWG for IDC (Insulation Displacement Contact) configurations and operates reliably across a temperature range of -65°C to +105°C. The connector carries a maximum current rating of 3 amps per single contact in free air at 267 V operating voltage, making it suitable for industrial applications including medical instruments, automotive controls, computers, and telecommunications equipment. The swage option on posts provides secure retention in printed circuit boards, and the design supports both latching and polarization features for reliable mating.
Points forts du produit:
- Header
- Number of Positions = 3
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
Search Keywords: 1037352
SPÉCIFICATION
EN STOCK: 577
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 270
Quantité minimale de commande pour qté en rupture de stock: 270
Multiple: 54
DÉLAI DE L'USINE 15 Weeks
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