DESCRIPTION
104666-3 is a double-row vertical through-hole header designed for board-to-board interconnection applications. This 40-position header features a 0.050 x 0.100 inch (1.27 x 2.54 mm) centerline pitch with a post length of 0.145 inch (3.68 mm) and dimension A of 1.130 inch (28.70 mm). The housing is constructed from glass-filled thermoplastic rated 94V-0, while contacts are made of copper alloy with duplex plating featuring gold in the mating area and tin on solder posts over nickel underplating. This RoHS-compliant component is part of the AMPMODU interconnection system and is suitable for various electronic applications requiring reliable board-to-board connections.
Product Highlights:
- Housing Gender = Header - Pin
- 40 Positions
- Number of Rows = Dual
- Shrouded
- Vertical Mount Angle
Search Keywords: 1046663
SPÉCIFICATION
EN STOCK: 442
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 16
Quantité minimale de commande pour qté en rupture de stock: 16
Multiple: 16
DÉLAI DE L'USINE 19 Weeks
PRICE (USD)
ressources
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