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1-87499-2
06 MODIV HSG COMP SR .100CL ...
DESCRIPTION
The 1-87499-2 is a single-row receptacle housing assembly part of the AMPMODU Mod IV Interconnection System, designed for wire-to-board connections with dual entry and end-stackable configuration. The housing features a 0.100 inch by 0.100 inch [2.54 x 2.54 mm] centerline spacing with low-profile design and 0.200 inch [5.08 mm] tine spacing, constructed from glass-filled thermoplastic material rated 94V-0. The contact area includes localized gold plating with duplex plating options (Plating A, B, or C) on matte tin solder areas, all over 0.00127 inch [0.00127 mm] nickel, and the assembly is RoHS compliant. This receptacle housing is suitable for applications requiring reliable multi-position interconnections in compact, stackable configurations, with contact current ratings of 3 amperes and termination resistance of 12 milliohms maximum for beryllium copper contacts.
Points forts du produit:
- Connector
- Without Contacts
- Housing Gender = Connector - Receptacle
- Housing Accepts Contact Type = Receptacle
- 2.54 mm Centerline
Mots-clés de recherche: 1874992
SPÉCIFICATIONS
EN STOCK: 5 851
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Quantité minimale de commande: 50
DÉLAI DE L'USINE 49 Semaines
Prix (USD)
3D PDF
Fiche technique
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
