Connexion
FR
English
Français
87456-1
06 MODIV HSG COMP DR .100CL ...
DESCRIPTION
The 87456-1 is a single-row receptacle housing assembly from the AMPMODU Mod IV interconnection system designed for wire-to-board applications with 0.100 inch (2.54 mm) centerline spacing and end-to-end stackable configuration. The housing features a dual cantilever contact beam with built-in anti-overstress capability for reliable matings, accommodates 0.025 inch (0.64 mm) square or round post contacts, and is constructed from glass-filled thermoplastic material rated 94V-0. The receptacle assembly terminates 32-20 AWG (0.03-0.6 mm²) discrete wire with insulation support and offers a choice of three contact mating pressures with multiple gold and tin plating options. This product is ideal for applications requiring compact, stackable interconnections in electronic assemblies where reliable wire-to-board connections and space efficiency are critical.
Points forts du produit:
- Receptacle Housing
- Wire Termination Type = Crimp
- Number of Positions = 6
- Housing Type = Receptacle
- Number of Rows = Dual
Mots-clés de recherche: 874561
SPÉCIFICATIONS
EN STOCK: 5 054
Expédition today, Saisissez la valeur du paramètre.
Quantité minimale de commande: 25
DÉLAI DE L'USINE 49 Semaines
3D PDF
Fiche technique
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
