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HTS191-P by te connectivity / chip coolers brand
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HTS191-P

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

Fiche technique
RoHS Compliant
Tray Emballage
ACCESSOIRES
Arrêté
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantie du certificat de conformité

DESCRIPTION

HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.

Points forts du produit:

  • Heat Sink
  • BGA
  • Package Size = 25 [.985] mm [in]
  • For Use With BGA Semiconductor Packages
  • Diameter = 25.00 mm

Search Keywords: HTS191P

SPÉCIFICATION

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Produits trouvés : 0
fournisseur:
TE Connectivity / Chip Coolers Brand
Référence:
HTS191-P
Alias/également connu sous:
5-1542000-6
Unité de mesure:
Par Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Tray
Life Cycle:
Arrêté
  This product is discontinued, but still in stock

EN STOCK: 232

Expédition today, if you order in

Commande min Quantitè: 6

Prix (USD)

QTÉ
Prix unitaire
6
$20.48
27
$19.51
110
$18.61
270
$17.81
790 +
$17.06
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