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HTS264NF-D by te connectivity / chip coolers brand
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HTS264NF-D

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized ...

RoHS Compliant
Box Emballage
ACCESSOIRES
Arrêté
This product is backed by Electro Sonic' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantie du certificat de conformité

DESCRIPTION

The HTS264NF-D is a 27mm passive heat sink assembly designed for thermal management of BGA semiconductor packages. It features a single pin-fin design constructed from cold-forged aluminum with black anodized plating, providing efficient heat dissipation without active cooling. The heat sink measures 34.95 mm in diameter and 12.7 mm in height, with thermal resistance values ranging from 3.36°C/W to 12.44°C/W depending on air velocity conditions (0 to 600 LFM). It includes a four-leg standard clip mounting system that does not increase the overall height, enabling easy installation on BGA devices. This passive solution is ideal for applications requiring reliable thermal management in compact form factors, with compliance to UL 94V-0 flammability standards and EU RoHS/ELV regulations.

Search Keywords: HTS264NFD

SPÉCIFICATION

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fournisseur:
TE Connectivity / Chip Coolers Brand
Référence:
HTS264NF-D
Alias/également connu sous:
1-1542001-2
Unité de mesure:
Par Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Box
Life Cycle:
Arrêté
  This product is discontinued, but still in stock

EN STOCK: 105

Peut être expédié immédiatement

Commande min Quantitè: 5

Prix (USD)

QTÉ
Prix unitaire
5
$17.51
21
$17.20
41
$16.87
82
$16.54
225
$16.22
500 +
$11.35

Outils/Modèles 3D