625-25AB
WakefieldHeat Sink - Top Mount - BGA - Thermal Tape, Adhesive (Included) - 0.984" (25.00mm) Square - 6.35mm Pin Fins - 12.00°C/W @ 500 LFM - Aluminum. ...
DESCRIPTION
The WAKEFIELD part 625-25AB is a high-quality heat sink designed specifically for passive BGA pin array applications. It features a durable adhesive that ensures secure attachment to the BGA pin array, while its aluminum construction provides excellent heat dissipation properties. The heat sink is finished with a sleek black anodized coating, adding a touch of elegance to any electronics application. With its reliable performance and attractive design, the WAKEFIELD 625-25AB is the perfect choice for effectively managing heat in BGA pin array setups.
Search Keywords: 62525AB
SPÉCIFICATION
EN STOCK: 1,126
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 5
Quantité minimale de commande pour qté en rupture de stock: 400
DÉLAI DE L'USINE 16 Weeks
PRICE (USD)
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