Connexion
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DESCRIPTION
The 103908-7 is a swaged tall vertical through-hole (THT) header designed for the AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced durability and conductivity. This header supports wire-to-board and wire-to-wire interconnection applications with insulation displacement contacts (IDC) or crimp snap-in contacts, accommodating 2 to 25 positions per row with 100 mil centerline spacing. The product operates over a temperature range of -65°C to +105°C and supports current ratings of 3 amps per contact in free air at 267 V operating voltage. The swaged post design provides superior retention in printed circuit boards, making it ideal for industrial applications including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where reliable, polarized, and latching connections are required.
Points forts du produit:
- Header
- Number of Positions = 8
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
Mots-clés de recherche: 1039087
SPÉCIFICATIONS
EN STOCK: 2 598
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 115
Quantité minimale de commande pour qté en rupture de stock: 115
Multiple: 23
DÉLAI DE L'USINE 17 Semaines
3D PDF
Product Drawing - HDR ASSY, AMPMODU MTE, VERTICAL, SINGLE ROW, .100 CL, .025 SQ POSTS WITH LATCH
Fiche technique
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
