DESCRIPTION

1-390262-3 is a 32-position DIP socket designed for through-hole mounting of integrated circuits. It features a ladder frame style with a row-to-row spacing of 15.24 mm (0.600 in) and a centerline pitch of 2.54 mm (0.100 in). The socket utilizes phosphor bronze contacts with tin plating on the mating area and dual leaf contact design for reliable electrical connections. Key electrical characteristics include an insulation resistance of 10,000 MO and contact resistance of 30 mO. Operating over a temperature range of -40°C to +105°C and compatible with lead-free wave solder processes up to 265°C, this RoHS-compliant socket is suitable for a wide range of electronic assembly applications requiring reliable IC socketing.