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DESCRIPTION
516-AG10D-ES is a 16-position DIP socket designed for through-hole mounting applications. It features a vertical mount style with a row-to-row spacing of 7.62 mm (0.300 in) and a centerline of 2.54 mm (0.100 in). The socket utilizes stamped and formed beryllium copper contacts with gold plating (25) on the mating area and a four-fingered mating contact design for reliable connections. With a height above PC board of 4.57 mm (0.180 in) and an operating temperature range up to 125°C, this RoHS/ELV compliant socket is wave solder capable up to 265°C. It is ideal for integrated circuit mounting in electronic assemblies requiring secure and reliable DIP package connections.
Points forts du produit:
- DIP Socket
- Number of Positions = 16
- Row-to-Row Spacing = 7.62 mm
- Thru Hole
- Mount Style = Vertical
Mots-clés de recherche: 14375363
SPÉCIFICATIONS
EN STOCK: 1 731
Peut être expédié immédiatement
Quantité minimale de commande: 30
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