DESCRIPTION

The 1-5316077-1 is a fine-pitch surface mount board-to-board receptacle connector designed for stacking applications. It features 160 positions arranged in a dual-row, in-line contact layout with a 0.6 mm centerline pitch and a board-to-board stack height of 4.0 mm. The connector is constructed with high-temperature thermoplastic housing (UL 94V-0 rated), copper alloy contacts with gold plating in the mating area, and gold over nickel plating on the solder tail termination. It includes grounding contacts and locating posts for secure alignment, with a keyed design to prevent mating errors. This receptacle is ideal for high-density interconnect applications in consumer electronics, computing, and telecommunications equipment where space constraints and reliable signal transmission are critical requirements.

Points forts du produit:

Receptacle
Family Name = Free Height
.60 mm Centerline
Number of Positions = 160
In-Line Contact Layout

Potential Applications:

Search Keywords: 153160771

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1-5316077-1

DESCRIPTION

SPÉCIFICATION

Prix (USD)

Outils/Modèles 3D

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