Connexion
FR
English
Français
3-87456-9
50 MODIV HSG COMP DR .100CL ...
DESCRIPTION
3-87456-9 is a double-row plain housing designed for the AMPMODU Mod IV wire-to-board interconnection system. This unstamped housing features 50 positions with .100 x .100 inch [2.54 x 2.54 mm] centerline spacing and is manufactured from glass-filled thermoplastic rated 94V-0. The housing accepts receptacle contacts that terminate 32-20 AWG discrete wire and mates with .025 inch square or round posts. With a contact current rating of 3 amperes and dual cantilever contact beam design with anti-overstress feature, this housing is suitable for reliable wire-to-board connections in various electronic applications.
Points forts du produit:
- Housing
- Not Preloaded
- Number of Positions = 50
- Housing Type = Receptacle
- Number of Rows = Dual
Mots-clés de recherche: 3874569
SPÉCIFICATIONS
EN STOCK: 1 698
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock: 5
Quantité minimale de commande pour qté en rupture de stock: 700
DÉLAI DE L'USINE 26 Semaines
Prix (USD)
3D PDF
Fiche technique
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
