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25AA1024-I/SM

en stock: 6 143

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25AA1024T-I/SM by microchip technology

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Microchip Technology Distributeur agréé

25AA1024T-I/SM

EEPROM Memory - 1Mbit - 128K x 8 Memory Organization - SPI Memory Interface - 20 MHz - 6ms - 1.8V to 5.5V Supply - 8-SOIJ Package - Surface Mount. ...

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Conforme RoHS

REEL Emballage

Ce produit peut nécessiter une documentation supplémentaire. L'expédition peut être retardée de 1-2 jours.

DESCRIPTION

The 25AA1024T-I/SM from Microchip Technology is surface mount EEPROM memory with 1Mbit memory size, 128K x 8 memory organization, 20 MHz clock frequency and 6ms write cycle time. This EEPROM memory has SPI memory interface and comes in 8-pin SOIJ package. The 25AA1024T-I/SM has wide supply voltage range from 1.8V to 5.5V. Operating temperature range is from -40°C to 85°C.

Points forts du produit:

Applications potentielles:

Mots-clés de recherche: 25AA1024TISM

SPÉCIFICATIONS

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fournisseur:

Microchip Technology

Référence:

25AA1024T-I/SM

Unité de mesure:

Par Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

3A991.b.1.b.2

Emballage en bobine: Ces informations sont destinées aux clients qui préfèrent acheter par multiples de la quantité de conditionnement standard du fabricant. Les quantités minimales et les multiples de commande requis sont indiqués avec le prix et la disponibilité.

Ces informations sont destinées aux clients qui préfèrent acheter par multiples de la quantité de conditionnement standard du fabricant. Les quantités minimales et les multiples de commande requis sont indiqués avec le prix et la disponibilité.

2100

Type de boîtier:

REEL

Rétention des données:

200(Min) Year

Différentes options d'emballage disponibles. Voir les alternatives

EN STOCK: 7 808

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Quantité BONDED: 0

Stock du fabricant: 0

Lot de stock uniquement:

Quantité minimale de commande pour qté en stock: 100

Quantité minimale de commande pour qté en rupture de stock: 525

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DÉLAI DE L'USINE 23 Semaines

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Prix (USD)

QTÉ

Prix unitaire

100

$4.24

250

$4.20

525

$4.19

1 050

$4.18

1 575

$4.16

2 100 +

$4.11

Emballage en bobine

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Outils/Modèles 3D

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Modifications du produit

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 06-Mar-2006 -

PCN - 24-May-2010 - Microchip has released a new DeviceDoc for the 25AA1024 Device Data Sheet of devices.

PCN - 24-May-2010 - DATA SHEET-25AA1024 DEVICE DATA SHEET

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com

PCN - 08-Nov-2010 - QUALIFICATION OF 8L SOIJ PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat

PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 22-Oct-2013 - PCN REVISED: REMOVED DEVICES FROM THE FINAL NOTIFICATION

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 14-Oct-2021 - DATA SHEET - 25AA1024 1 MBIT SPI BUS SERIAL EEPROM DEVICE DATA SHEET DOCUMENT REVISION

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 11-Nov-2004 -

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 06-Feb-2010 - DATA SHEET-25AA1024 DEVICE DATA SHEET

PCN - 07-Oct-2005 -

PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com

PCN - 06-Mar-2006 - Product Change Notice

PCN - 11-Nov-2004 - Product Change Notice

PCN - 07-Oct-2005 - Product Change Notice

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