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87456-7
12 MODIV HSG COMP DR .100CL ...
DESCRIPTION
The 87456-7 is a double-row receptacle housing assembly from the AMPMODU Mod IV Interconnection System, designed for wire-applied connections with dual-entry, end-stackable configuration and low-profile construction. It features .100 x .100 inch (2.54 x 2.54 mm) centerline spacing with .200 inch (5.08 mm) tine spacing, accommodating 32–20 AWG (0.03–0.6 mm²) discrete wire terminations with insulation support on contacts. The housing is constructed from glass-filled thermoplastic (94V-0 rated) in black, with multiple plating options including duplex gold and matte tin finishes on contact and solder areas. The receptacle employs dual cantilever contact beams with built-in anti-overstress features for reliable matings, and is available in stamped and unstamped variants with optional detent latching and polarization. This product is widely used in wire-to-board interconnection applications requiring compact, stackable multi-position connectors in industrial, telecommunications, and consumer electronics equipment.
Points forts du produit:
- Receptacle Housing
- Wire Termination Type = Crimp
- Number of Positions = 12
- Housing Type = Receptacle
- Number of Rows = Dual
Mots-clés de recherche: 874567
SPÉCIFICATIONS
EN STOCK: 7 716
Peut être expédié immédiatement
Quantité minimale de commande: 10
DÉLAI DE L'USINE 52 Semaines
3D PDF
Fiche technique
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
